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This white paper shows that very wide bandwidth RF launches are possible to implement in PCBs, even with vias included. This does not mean it is a trivial task. Competing requirements, be they electrical, mechanical, manufacturing, or cost, must be considered and balanced simultaneously.
This white paper elaborates on some of the most important design considerations. Optimizing these factors requires working with your PCB house to understand those manufacturing limitations. Ultimately, getting to 90-100 GHz bandwidths will, in many cases, require pushing the edge of today’s fabrication limits. Understanding the limits at the start of the design process goes a long way toward reaching a high-performance launch, which ultimately means high-fidelity connections to your device.
The paper begins by defining an RF launch. The launch includes the connector, signal via, and the via to the trace transition inside the PCB.
Four primary topics are discussed:
1: Impact of Via Stubs
2: Correct Ground Ring Sizing
3: Misregistration Compensation
4: Launch Performance Issues Introduced During Connector Assembly
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