| Part No. | Stock Qty | Price Breaks | Qty | ||||
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UMPT-05-01.5-T-V-S-TR 3D CAD
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Standard delivery 8 - 10 working days * |
1+: £3.30 | 25+: £3.21 | 50+: £3.04 | View all prices | ||
* Delivery times are from point of order and subject to material availability.
* When ordering more than in stock, please contact us to confirm delivery time
* Need help or more stock/delivery information or volume pricing - Please contact us
Insulator: Black LCP
Contact: Copper Alloy
Weld Tab: Phospher Bronze
Plating: Sn or Au over 50µ" Ni
Operating Temp: -55°C to +105°C Tin / -55°C to +125°C Gold
RoHS Compliant and Lead Free Solderable
Current Rating Per Contact UMPT/UMPS mated
1 Pin = 18.3A / 2 Pins = 14.5A / 3 Pins = 14.2A / 4 Pins = 12.9A / 5 Pins 12.9A
Samtec Micro Rugged Board-to-Board
Micro 2mm pitch power blade interconnects designed for staging a combination power and signal/ground solution. With a variety of mated heights available, design engineers can create unique power/signal combinations to suit their application choosing from a variety of Samtec series.
mPOWER™ can be used as a standalone high-power solution, or alongside one of Samtec’s high-speed connector systems for a unique two-piece power and signal/ground solution. Compatible Samtec high-speed systems include: AcceleRate® HD, Edge Rate®, SEARAY™, SEARAY™ 0.80 mm, LP Array™, Q Strip®, Q2™, Tiger Eye™ and more.
See the data sheet for more on the possible stack height combinations available.
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