| Part No. | Stock Qty | Price Breaks | Qty | ||||
|---|---|---|---|---|---|---|---|
|
GMI-10-2-1.27-G-10
3D CAD
|
Standard delivery 5 - 7 working days * |
1+: £10.14 | 10+: £9.86 | 25+: £9.34 | View all prices | ||
|
GMI-20-2-1.27-G-10
3D CAD
|
Standard delivery 5 - 7 working days * |
1+: £20.27 | 10+: £19.71 | 25+: £18.67 | View all prices | ||
|
GMI-30-2-1.27-G-10
3D CAD
|
Standard delivery 5 - 7 working days * |
1+: £29.53 | 10+: £28.71 | 25+: £27.20 | View all prices | ||
* Delivery times are from point of order and subject to material availability.
* When ordering more than in stock, please contact us to confirm delivery time
* Need help or more stock/delivery information or volume pricing - Please contact us
Insulator Material: Black LCP
Contact Material: Copper Alloy
Plating: Au over 50 μ" (1.27 μm) Ni
Current Rating: .89 A per pin (10 pins powered)
High-speed low profile one-piece compression arrays 1.27mm standard body height on 1.00mm pitch. Dual compression contacts available across 100 – 300 total pins. Ideal for low-cost board stacking, module-to-board and LGA interfaces. Minimizes thermal expansion issues and is Analog Over Array™ capable.
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