FTSH - Samtec 1.27mm Through Hole Micro Header (FTSH)

From: £0.169

Micro header with various post heights
Available in surface mount and through-hole tails
End shroud option available
Vertical and horizontal row configurations
Impedance matched for high speed applications (Mated with CLP Series)

FTSH series is a JTAG standard connector series

Part No.	Stock Qty	Price Breaks					Qty
FTSH-105-01-F-D-K 3D CAD 1.27mm Micro Header	1657 in stock	1+: £0.98	100+: £0.96	250+: £0.91	View all prices		When ordering more than in stock, please contact us to confirm delivery time. There was a problem adding this item to the cart. Please contact us on the above number to order.

Qty.	Unit Price	Ext. Price

* Delivery times are from point of order and subject to material availability.

* When ordering more than in stock, please contact us to confirm delivery time.

* Need help or more stock/delivery information or volume pricing - Please contact us

* Delivery times are from point of order and subject to material availability.

* When ordering more than in stock, please contact us to confirm delivery time

* Need help or more stock/delivery information or volume pricing - Please contact us

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Technical Specification
More Info

Insulator Material: Black Liquid Crystal Polymer

Terminal Material: Phosphor Bronze

Plating: Sn or Au over 50µ" (1.27µm) Ni

Current Rating (FTSH/CLP): 3.3 A per pin (1 pin powered per row)

Operating Temp Range: -55°C to +125°C

RoHS Compliant

Lead-Free Solderable

A range of header strips for high mating cycle applications. The FTSH is highly configurable, offering through-hole, surface mount and mixed technology terminations, available in vertical and horizontal orientations, and it can be polarized and keyed to avoid incorrect installation.

JTAG Connectors, Joint Test Action Group

Joint Test Action Group, also known as JTAG, is the common name for IEEE standard 1149.1. This standard defines a particular method for testing board-level interconnects, which is also called Boundary Scan. In short, JTAG was created as a way to test for common problems, but lately has become a way of configuring devices. The JTAG hardware interprets information from five different signals: TDI (Test Data In), TDO (Test Data Out), TMS (Test Mode Select), TCK (Test Clock), and TRST (Test Report-optional).

The primary advantage of boundary-scan technology is the ability to observe data at the device inputs and control the data at the outputs independently of the application logic. Simple tests can find manufacturing defects such as unconnected pins, a missing device, an incorrect or rotated device on a circuit board, and even a failed or dead device.