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ADF6-60-03.5-L-4-2-A-TR 3D CAD
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62 in stock | 1+: £16.48 | 10+: £16.48 | 25+: £16.48 | View all prices |
When ordering more than in stock, please contact us to confirm delivery time.
There was a problem adding this item to the cart. Please contact us on the above number to order.
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* Delivery times are from point of order and subject to material availability.
* When ordering more than in stock, please contact us to confirm delivery time.
* Need help or more stock/delivery information or volume pricing - Please contact us
* Delivery times are from point of order and subject to material availability.
* When ordering more than in stock, please contact us to confirm delivery time
* Need help or more stock/delivery information or volume pricing - Please contact us
Packaging Type: Tape & Reel = -FR Option = ‘Full Reel’ package - Most Cost Effective Pack option
Tape & Reel products ordered in less than full reel quantities (-TR Type) will be provided without leader and trailer.
Only products ordered in Full Reel (-FR) increments will have a leader and trailer.
Insulator Material: Black LCP
Contact Material: Copper Alloy
Plating: Au or Sn over 50 μ" (1.27 μm) Ni
Operating Temp Range: -55 °C to +125 °C
Current Rating: 1.34 A per pin (4 pins powered)
AcceleRate® HD features high-speed Edge Rate® contacts designed for high-speed, high-cycle applications.
The surface of the contact is milled creating a smooth mating surface, which reduces wear on the contact increasing durability and cycle life. Also, lower insertion and withdrawal forces allow zippered unmating. ADF6 series is incredibly dense with up to 240 total I/Os with up to 400 in development. Low profile 5mm stack height, slim 5mm width and 4 row design feature in this connector. Available 0 - 60 positions per row. 70 - 100 total positions per row in development, 7 - 16 mm stack heights, right-angle and cable are also in development
ADF6 series utilises Samtec's Edge Rate® contact system optimized for signal integrity performance. Open-pin-field design for grounding and routing flexibility, supports 56 Gbps PAM4 (28 Gbps NRZ) applications.
PCIe® Gen 5 compatible, with solder ball technology for simplified processing and self aligning. 7 - 16 mm stack heights, right-angle and cable in development
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